Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11905412 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Takahiro Taki, Takako Ejiri, Tetsuro Iwakura, Kana Uchimura, Toshiki Fujii +2 more | 2024-02-20 |
| 5741449 | Cylinder temperature setting method for injection molding machine | Masato Yamamura, Tokuhisa Miyauchi, Noriaki Neko | 1998-04-21 |
| 5551857 | Cylinder temperature controller for an injection molding machine | Tokuhisa Miyauchi, Noriaki Neko | 1996-09-03 |