| 5008997 |
Gold/tin eutectic bonding for tape automated bonding process |
— |
1991-04-23 |
| 4839717 |
Ceramic package for high frequency semiconductor devices |
James M. Early, Kevien J. Negus |
1989-06-13 |
| 4796080 |
Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate |
— |
1989-01-03 |
| 4791473 |
Plastic package for high frequency semiconductor devices |
— |
1988-12-13 |
| 4772935 |
Die bonding process |
Harlan Lawler |
1988-09-20 |
| 4751199 |
Process of forming a compliant lead frame for array-type semiconductor packages |
— |
1988-06-14 |
| 4688075 |
Integrated circuit having a pre-attached conductive mounting media and method of making the same |
— |
1987-08-18 |
| 4674808 |
Signal ground planes for tape bonded devices |
— |
1987-06-23 |
| 4653175 |
Semiconductor structure having alpha particle resistant film and method of making the same |
Michael Brueggeman, James W. Clark |
1987-03-31 |
| 4594493 |
Method and apparatus for forming ball bonds |
Shane Harrah |
1986-06-10 |
| 4515662 |
Process for fabricating precision optical spacers for image sensor filters |
— |
1985-05-07 |
| 4390598 |
Lead format for tape automated bonding |
— |
1983-06-28 |
| 4388525 |
Precision optical spacers for image sensor filters |
— |
1983-06-14 |
| 4380566 |
Radiation protection for integrated circuits utilizing tape automated bonding |
— |
1983-04-19 |