Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5008997 | Gold/tin eutectic bonding for tape automated bonding process | — | 1991-04-23 |
| 4839717 | Ceramic package for high frequency semiconductor devices | James M. Early, Kevien J. Negus | 1989-06-13 |
| 4796080 | Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate | — | 1989-01-03 |
| 4791473 | Plastic package for high frequency semiconductor devices | — | 1988-12-13 |
| 4772935 | Die bonding process | Harlan Lawler | 1988-09-20 |
| 4751199 | Process of forming a compliant lead frame for array-type semiconductor packages | — | 1988-06-14 |
| 4688075 | Integrated circuit having a pre-attached conductive mounting media and method of making the same | — | 1987-08-18 |
| 4674808 | Signal ground planes for tape bonded devices | — | 1987-06-23 |
| 4653175 | Semiconductor structure having alpha particle resistant film and method of making the same | Michael Brueggeman, James W. Clark | 1987-03-31 |
| 4594493 | Method and apparatus for forming ball bonds | Shane Harrah | 1986-06-10 |
| 4515662 | Process for fabricating precision optical spacers for image sensor filters | — | 1985-05-07 |
| 4390598 | Lead format for tape automated bonding | — | 1983-06-28 |
| 4388525 | Precision optical spacers for image sensor filters | — | 1983-06-14 |
| 4380566 | Radiation protection for integrated circuits utilizing tape automated bonding | — | 1983-04-19 |