Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process of forming a compliant lead frame for array-type semiconductor packages

Process of forming a compliant lead frame for array-type semiconductor packages

US Patent 4751199 · Granted Jun 14, 1988

Estimated economic value: $16,587,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gold/tin eutectic bonding for tape automated bonding process1991
Ceramic package for high frequency semiconductor devices1989
Semiconductor chip package configuration and method for facilitating its testing1989
Plastic package for high frequency semiconductor devices1988
Die bonding process1988
Integrated circuit having a pre-attached conductive mounting media and method of1987
Signal ground planes for tape bonded devices1987
Semiconductor structure having alpha particle resistant film and method of makin1987
Method and apparatus for forming ball bonds1986
Process for fabricating precision optical spacers for image sensor filters1985
Lead format for tape automated bonding1983
Precision optical spacers for image sensor filters1983