WP

Wolfgang Pahl

EA Epcos Ag: 26 patents #6 of 606Top 1%
Tdk: 17 patents #321 of 3,796Top 9%
SA Siemens Aktiengesellschaft: 6 patents #2,149 of 22,248Top 10%
SN Snaptrack: 6 patents #9 of 213Top 5%
SK Siemens Matsushita Components Gmbh & Co. Kg: 4 patents #1 of 62Top 2%
📍 Birkenfeld, DE: #3 of 1,442 inventorsTop 1%
Overall (All Time): #37,827 of 4,157,543Top 1%
61
Patents All Time

Issued Patents All Time

Showing 51–61 of 61 patents

Patent #TitleCo-InventorsDate
6931699 Method of producing a surface wave component with a drain for pyroelectric voltage Heiner Bayer 2005-08-23
6528924 Electronic component, in particular a component operating with surface acoustic waves Alois Stelzl, Hans Kruger 2003-03-04
6449828 Method of producing a surface acoustic wave component Alois Stelzl, Hans Kruger 2002-09-17
6446316 Method for producing an encapsulation for a SAW component operating with surface acoustic waves Bruno Fürbacher, Friedrich Lupp, Gunter Trausch 2002-09-10
6310420 Electronic component in particular an saw component operating with surface acoustic waves and a method for its production Alois Stelzl, Hans Kruger 2001-10-30
6242842 Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production Alois Stelzl, Hans Kruger 2001-06-05
6136175 Method of producing an electronic component, in particular a surface acoustic wave component Alois Stelzl, Hans Kruger, Jurgen Machui 2000-10-24
6057222 Method for the production of flip-chip mounting-ready contacts of electrical components Alois Stelzl, Hans Kruger 2000-05-02
5900286 Method of producing an attenuating structure on a surface wave component Heiner Bayer, Walter Fischer, Winfried Plundrich, Hans Stelzl 1999-05-04
5831369 Encapsulation for electronic components and method for producing the encapsulation Bruno Fürbacher, Friedrich Lupp, Gunter Trausch 1998-11-03
4803448 Cantilever mount of a substrate lamina of a surface wave device Peter Zibis 1989-02-07