BF

Bruno Fürbacher

SK Siemens Matsushita Components Gmbh & Co. Kg: 2 patents #3 of 62Top 5%
EA Epcos Ag: 1 patents #321 of 606Top 55%
Overall (All Time): #1,618,097 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6462272 Planar resist structure, in particular an encapsulation for electronic component, and thermomechanical production process 2002-10-08
6446316 Method for producing an encapsulation for a SAW component operating with surface acoustic waves Friedrich Lupp, Wolfgang Pahl, Gunter Trausch 2002-09-10
5831369 Encapsulation for electronic components and method for producing the encapsulation Friedrich Lupp, Wolfgang Pahl, Gunter Trausch 1998-11-03