BV

Bert M. Vermeire

EM Environmental Metrology: 6 patents #1 of 2Top 50%
RG Ridgetop Group: 5 patents #1 of 11Top 10%
Caltech: 1 patents #2,143 of 4,321Top 50%
📍 Tucson, AZ: #592 of 6,004 inventorsTop 10%
🗺 Arizona: #3,015 of 32,909 inventorsTop 10%
Overall (All Time): #420,441 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
9024606 Low-to-medium power single chip digital controlled DC-DC regulator for point-of-load applications Philippe C. Adell, Bertan Bakkaloglu, Tao Liu 2015-05-05
8253422 Method of manufacture of wafers using an electro-chemical residue sensor (ECRS) Farhang F. Shadman 2012-08-28
8120368 Method of monitoring the clean/rinse/dry processes of patterned wafers using an electro-chemical residue sensor (ECRS) Farhang F. Shadman 2012-02-21
8030943 Circuit for the detection of solder-joint failures in a digital electronic package Philipp S. Spuhler, James P. Hofmeister 2011-10-04
7932726 Method of design optimization and monitoring the clean/rinse/dry processes of patterned wafers using an electro-chemical residue sensor (ECRS) Farhang F. Shadman 2011-04-26
7501832 Method and circuit for the detection of solder-joint failures in a digital electronic package Philipp S. Spuhler, James P. Hofmeister 2009-03-10
7489141 Surface micro sensor and method Farhang F. Shadman 2009-02-10
7332902 Micro sensor for electrochemically monitoring residue in micro channels Farhang F. Shadman 2008-02-19
7317317 Shielded micro sensor and method for electrochemically monitoring residue in micro features Farhang F. Shadman 2008-01-08
7271608 Prognostic cell for predicting failure of integrated circuits Harold G. Parks, Douglas L. Goodman 2007-09-18
7239163 Die-level process monitor and method Jeremy John Ralston-Good, Philipp S. Spuhler, Douglas L. Goodman 2007-07-03
7196294 Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package James P. Hofmeister, Philipp S. Spuhler 2007-03-27