| 7842547 |
Laser lift-off of sapphire from a nitride flip-chip |
Bryan Shelton, Sebastien Libon |
2010-11-30 |
|
| 7667236 |
Optimized contact design for thermosonic bonding of flip-chip devices |
Hari Venugopalan, Xiang Gao, Michael Sackrison |
2010-02-23 |
|
| 7635869 |
Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip |
Boris Kolodin, Michael Hsing, Stanton Earl Weaver, Srinath K. Aanegola |
2009-12-22 |
|
| 7456035 |
Flip chip light emitting diode devices having thinned or removed substrates |
Boris Kolodin, Emil P. Stefanov |
2008-11-25 |
|
| 7358539 |
Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts |
Hari Venugopalan |
2008-04-15 |
|
| 7285801 |
LED with series-connected monolithically integrated mesas |
Chris Bohler, Bryan Shelton, Hari Venugopalan, Xiang Gao |
2007-10-23 |
|
| 7190005 |
GaN LED with solderable backside metal |
Shawn R. Gibb, Robert F. Karlicek, Jr., Prosanto K. Mukerji, Hari Venugopalan |
2007-03-13 |
$41,124,000 |
| 7179670 |
Flip-chip light emitting diode device without sub-mount |
Bryan Shelton, Sebastien Libon, Hari Venugopalan, Stanton Earl Weaver, Chen-Lun Hsing Chen +3 more |
2007-02-20 |
$50,976,000 |
| 7115896 |
Semiconductor structures for gallium nitride-based devices |
Shiping Guo, David W. Gotthold, Milan Pophristic, Boris Peres, Bryan Shelton +3 more |
2006-10-03 |
$1,835,000 |
| 7087463 |
Laser separation of encapsulated submount |
Michael Sackrison, Xiang Gao, Bryan Shelton |
2006-08-08 |
$43,456,000 |
| 7084475 |
Lateral conduction Schottky diode with plural mesas |
Bryan Shelton, Linlin Liu, Alex Ceruzzi, Michael Murphy, Milan Pophristic +3 more |
2006-08-01 |
|
| 7078319 |
Laser separated die with tapered sidewalls for improved light extraction |
Mark Gottfried |
2006-07-18 |
$45,643,000 |
| 7064356 |
Flip chip light emitting diode with micromesas and a conductive mesh |
Emil P. Stefanov, Hari Venugopalan, Bryan Shelton |
2006-06-20 |
$33,096,000 |
| 7023022 |
Microelectronic package having improved light extraction |
Robert F. Karlicek, Jr., Hari Venugopalan |
2006-04-04 |
$3,177,000 |
| 7015516 |
Led packages having improved light extraction |
Robert F. Karlicek, Jr., Hari Venugopalan |
2006-03-21 |
$33,083,000 |
| 6964877 |
LED power package |
Chen-Lun Hsing Chen, Stanton Earl Weaver, Sebastien Libon, Mehmet Arik, David Mulford Shaddock |
2005-11-15 |
$71,331,000 |
| 6958498 |
Optimized contact design for flip-chip LED |
Bryan Shelton, Hari Venugopalan |
2005-10-25 |
$3,977,000 |
| 6902990 |
Semiconductor device separation using a patterned laser projection |
Mark Gottfried, Michael Gregory Brown, Robert F. Karlicek, Jr., James Nering |
2005-06-07 |
$3,381,000 |
| 6849524 |
Semiconductor wafer protection and cleaning for device separation using laser ablation |
Bryan Shelton, Mark Gottfried, Stephen Schwed |
2005-02-01 |
$2,446,000 |
| 6787435 |
GaN LED with solderable backside metal |
Shawn R. Gibb, Robert F. Karlicek, Jr., Prosanto K. Mukerji, Hari Venugopalan |
2004-09-07 |
|
| 6746889 |
Optoelectronic device with improved light extraction |
Hari Venugopalan, Bob Karlicek, Stanton Earl Weaver |
2004-06-08 |
$2,567,000 |
| 6661167 |
LED devices |
Mathew Sommers, Stanton Earl Weaver |
2003-12-09 |
|
| 6653215 |
Contact to n-GaN with Au termination |
Michael Gregory Brown, Keng Ouyang, Hari Venugopalan |
2003-11-25 |
$4,474,000 |
| 6642548 |
Light-emitting diodes with loop and strip electrodes and with wide medial sections |
Michael Gregory Brown, Louis A. Koszi |
2003-11-04 |
$4,645,000 |
| 6413839 |
Semiconductor device separation using a patterned laser projection |
Michael Gregory Brown, Mark Gottfried, Robert F. Karlicek, Jr., James Nering |
2002-07-02 |
$4,327,000 |