Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer protection and cleaning for device separation using laser ablation

Semiconductor wafer protection and cleaning for device separation using laser ablation

US Patent 6849524 · Granted Feb 1, 2005

Estimated economic value: $2,446,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrically conductive, gas-sealed, aluminum-to-aluminum connection and methods2019
Muon drift tube and method of making same2019
PIN diode structure with zinc diffusion region2011
Gallium nitride semiconductor device2011
Gallium nitride semiconductor device2011
Laser lift-off of sapphire from a nitride flip-chip2010
Laser lift-off of sapphire from a nitride flip-chip2010
Optimized contact design for thermosonic bonding of flip-chip devices2010
Support with recessed electrically conductive chip attachment material for flip-2009
PIN diode structure with zinc diffusion region2009
Flip chip light emitting diode devices having thinned or removed substrates2008
PIN photodiode structure and fabrication process for reducing dielectric delamin2008