KO

Kenjiro Ogata

Dow Global Technologies: 1 patents #2,632 of 4,534Top 60%
NH Nitta Haas: 1 patents #22 of 56Top 40%
RH Rohm And Haas Electronic Materials Cmp Holdings: 1 patents #157 of 239Top 70%
Overall (All Time): #2,805,001 of 4,157,543Top 70%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10722999 High removal rate chemical mechanical polishing pads and methods of making Thomas P. Willumstad, Bainian Qian, Rui Xie, George C. Jacob, Marty W. DeGroot 2020-07-28