Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9925618 | Laser processing apparatus | Tsutomu Maeda | 2018-03-27 |
| 8476553 | Method of dividing workpiece | Satoshi Usuda, Masaru Nakamura | 2013-07-02 |
| 7927974 | Method of forming a modified layer in a substrate | Yosuke Watanabe, Kenji Furuta | 2011-04-19 |
| 7483115 | Method of laser processing a liquid crystal device wafer | Koichi Shigematsu, Satoshi Kobayashi | 2009-01-27 |