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Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle |
Yusuke Tanaka, Saori SUGIOKA, Hidetsugu Namiki, Shoko KUGA |
2025-02-25 |
| 11402408 |
Electrical characteristics inspection tool |
Tomoyuki Ishimatsu, Hiroyuki Kumakura, Takako Kubota |
2022-08-02 |
| 10435601 |
Adhesive agent and connection structure |
Shiyuki Kanisawa, Hidetsugu Namiki, Akira Ishigami |
2019-10-08 |
| 10174225 |
Adhesive composition |
Hidetsugu Namiki |
2019-01-08 |
| 9994743 |
Adhesive and light-emitting device |
Shiyuki Kanisawa, Hidetsugu Namiki, Taichi Koyama, Akira Ishigami |
2018-06-12 |
| 9676066 |
Anisotropic conductive adhesive |
Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki |
2017-06-13 |
| 9670385 |
Anisotropic conductive adhesive |
Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami |
2017-06-06 |
| 9487678 |
Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive |
Hidetsugu Namiki, Shiyuki Kanisawa, Hideaki Umakoshi, Akira Ishigami |
2016-11-08 |
| 8852462 |
Light-reflective anisotropic conductive adhesive and light-emitting device |
Hideaki Umakoshi, Hidetsugu Namiki, Akira Ishigami, Shiyuki Kanisawa |
2014-10-07 |
| 8758546 |
Buffer film for multi-chip packaging |
Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Hideaki Umakoshi |
2014-06-24 |
| 8710662 |
Light-reflective anisotropic conductive paste and light-emitting device |
Hideaki Umakoshi, Hidetsugu Namiki, Akira Ishigami, Shiyuki Kanisawa, Yoshihisa Shinya |
2014-04-29 |