Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901325 | Multilayer substrate | Seiichiro Shinohara, Yasushi Akutsu | 2024-02-13 |
| 11624011 | Thermosetting adhesive sheet and semiconductor device manufacturing method | Daichi MORI | 2023-04-11 |
| 11402408 | Electrical characteristics inspection tool | Hiroyuki Kumakura, Masaharu Aoki, Takako Kubota | 2022-08-02 |
| 10943879 | Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure | Yasushi Akutsu | 2021-03-09 |
| 10832830 | Anisotropic electrically conductive film, method for producing same, and connection structural body | Reiji Tsukao | 2020-11-10 |
| 10589502 | Anisotropic conductive film, connected structure, and method for manufacturing a connected structure | — | 2020-03-17 |
| 10575410 | Anisotropic conductive film, manufacturing method thereof, and connection structure | Kenichi Haga, Yasushi Akutsu | 2020-02-25 |
| 10566108 | Anisotropic electrically conductive film, method for producing same, and connection structural body | Reiji Tsukao | 2020-02-18 |
| 10442958 | Anisotropic conductive film and production method of the same | Yuta Araki | 2019-10-15 |
| 10350872 | Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structure | — | 2019-07-16 |
| 10312125 | Protective tape and method for manufacturing semiconductor device using the same | Hironobu Moriyama, Hidekazu Yagi, Katsuyuki Ebisawa, Keiji HONJYO, Junichi Kaneko | 2019-06-04 |
| 10304587 | Anisotropic electrically conductive film, method for producing same, and connection structural body | Reiji Tsukao | 2019-05-28 |
| 10273386 | Thermosetting adhesive sheet and semiconductor device manufacturing method | Daichi MORI | 2019-04-30 |
| 10199358 | Multilayer substrate | Yasushi Akutsu | 2019-02-05 |
| 9924599 | Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure | — | 2018-03-20 |
| 9741598 | Protective tape and method for manufacturing a semiconductor device using the same | Hironobu Moriyama, Shingo DEGUCHI, Hidekazu Yagi | 2017-08-22 |
| 9253911 | Anisotropic conductive material and method for manufacturing same | Reiji Tsukao, Hiroki Ozeki | 2016-02-02 |
| 9023464 | Connecting film, and joined structure and method for producing the same | Yasushi Akutsu, Koichi Miyauchi | 2015-05-05 |
| 8987607 | Conductive particle, and anisotropic conductive film, bonded structure, and bonding method | Hiroki Ozeki, Reiji Tsukao | 2015-03-24 |
| 8980043 | Anisotropic conductive film, joined structure and method for producing the joined structure | — | 2015-03-17 |
| 8932716 | Conductive particle, and anisotropic conductive film, bonded structure, and bonding method | Yuta Araki | 2015-01-13 |
| 8796557 | Adhesive film, connecting method, and joined structure | Hiroki Ozeki | 2014-08-05 |
| 8524032 | Connecting film, and joined structure and method for producing the same | Yasushi Akutsu, Koichi Miyauchi | 2013-09-03 |
| 8395052 | Conductive particle, anisotropic conductive film, joined structure, and joining method | Hiroki Ozeki, Hiroshi Hamachi | 2013-03-12 |
| 8330052 | Joined structure and method for producing the same | Yukio Yamada | 2012-12-11 |