Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10604600 | Photocurable resin composition and cured product of same | Naruhito Iwasa, Hiroki Yamamoto | 2020-03-31 |
| 9670384 | Light-reflective anisotropic conductive adhesive and light-emitting device | Hidetsugu Namiki, Shiyuki Kanisawa | 2017-06-06 |
| 9548141 | Light-reflective anisotropic conductive adhesive and light-emitting device | Hidetsugu Namiki, Shiyuki Kanisawa | 2017-01-17 |
| 9487678 | Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive | Hidetsugu Namiki, Shiyuki Kanisawa, Masaharu Aoki, Akira Ishigami | 2016-11-08 |
| 9481804 | Electroconductive ink composition | Kensuke Kawamura | 2016-11-01 |
| 9340710 | Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device | Hidetsugu Namiki, Shiyuki Kanisawa | 2016-05-17 |
| 9260634 | Light-reflective anisotropic conductive adhesive agent, and light emitting device | Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami | 2016-02-16 |
| 8975654 | Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device | Hidetsugu Namiki, Shiyuki Kanisawa | 2015-03-10 |
| 8916894 | Light-reflective anisotropic conductive adhesive agent, and light emitting device | Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami | 2014-12-23 |
| 8852462 | Light-reflective anisotropic conductive adhesive and light-emitting device | Hidetsugu Namiki, Masaharu Aoki, Akira Ishigami, Shiyuki Kanisawa | 2014-10-07 |
| 8796725 | Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device | Hidetsugu Namiki, Shiyuki Kanisawa | 2014-08-05 |
| 8758546 | Buffer film for multi-chip packaging | Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki | 2014-06-24 |
| 8710662 | Light-reflective anisotropic conductive paste and light-emitting device | Hidetsugu Namiki, Akira Ishigami, Masaharu Aoki, Shiyuki Kanisawa, Yoshihisa Shinya | 2014-04-29 |
| 8415706 | Optical semiconductor package sealing resin material | — | 2013-04-09 |