HU

Hideaki Umakoshi

DE Dexerials: 10 patents #45 of 387Top 15%
OC Osaka Soda Co.: 2 patents #19 of 87Top 25%
SO Sony: 2 patents #12,963 of 25,231Top 55%
Overall (All Time): #346,531 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10604600 Photocurable resin composition and cured product of same Naruhito Iwasa, Hiroki Yamamoto 2020-03-31
9670384 Light-reflective anisotropic conductive adhesive and light-emitting device Hidetsugu Namiki, Shiyuki Kanisawa 2017-06-06
9548141 Light-reflective anisotropic conductive adhesive and light-emitting device Hidetsugu Namiki, Shiyuki Kanisawa 2017-01-17
9487678 Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive Hidetsugu Namiki, Shiyuki Kanisawa, Masaharu Aoki, Akira Ishigami 2016-11-08
9481804 Electroconductive ink composition Kensuke Kawamura 2016-11-01
9340710 Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device Hidetsugu Namiki, Shiyuki Kanisawa 2016-05-17
9260634 Light-reflective anisotropic conductive adhesive agent, and light emitting device Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami 2016-02-16
8975654 Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device Hidetsugu Namiki, Shiyuki Kanisawa 2015-03-10
8916894 Light-reflective anisotropic conductive adhesive agent, and light emitting device Hidetsugu Namiki, Shiyuki Kanisawa, Akira Ishigami 2014-12-23
8852462 Light-reflective anisotropic conductive adhesive and light-emitting device Hidetsugu Namiki, Masaharu Aoki, Akira Ishigami, Shiyuki Kanisawa 2014-10-07
8796725 Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device Hidetsugu Namiki, Shiyuki Kanisawa 2014-08-05
8758546 Buffer film for multi-chip packaging Akira Ishigami, Shiyuki Kanisawa, Hidetsugu Namiki, Masaharu Aoki 2014-06-24
8710662 Light-reflective anisotropic conductive paste and light-emitting device Hidetsugu Namiki, Akira Ishigami, Masaharu Aoki, Shiyuki Kanisawa, Yoshihisa Shinya 2014-04-29
8415706 Optical semiconductor package sealing resin material 2013-04-09