TI

Tetsuya Itou

DE Denso: 6 patents #2,220 of 11,792Top 20%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
FL Fujitsu Microelectronics Limited: 1 patents #212 of 624Top 35%
FL Fujitsu Semiconductor Limited: 1 patents #612 of 1,301Top 50%
YE Yaskawa Electric: 1 patents #557 of 1,006Top 60%
SO Soken: 1 patents #60 of 182Top 35%
TJ Transphorm Japan: 1 patents #12 of 26Top 50%
Overall (All Time): #456,028 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10731770 Electric flow control valve and actuator Yasuhiro Kawase, Yukikatsu Ozaki, Mikio Matsuda, Sadahisa Onimaru, Hiroki Ishii 2020-08-04
10520231 Integrated valve Masaaki Kawakubo 2019-12-31
10391839 Refrigeration cycle device Masaaki Kawakubo, Satoshi Itoh 2019-08-27
9683761 Integration valve and heat pump cycle Teruyuki Hotta, Atsushi Inaba, Yukihiko Takeda, Shigeji Ohishi, Keiichi Yoshii 2017-06-20
9109823 Integration valve Yukihiko Takeda, Teruyuki Hotta, Atsushi Inaba, Keiichi Yoshii, Shigeji Ohishi 2015-08-18
9099545 Compound semiconductor device and method of manufacturing same Shinichi Akiyama, Kenji Nukui, Mutsumi Katou, Yoshitaka Watanabe, Yoichi Fujisawa +3 more 2015-08-04
8769984 Decompression device Teruyuki Hotta, Atsushi Inaba 2014-07-08
8614527 Motor and vehicle Toshio NAGAO, Yuuto Fukuma, Takeshi Inoue 2013-12-24
8569124 Method of manufacturing compound semiconductor device with gate electrode forming before source electrode and drain electrode Shinichi Akiyama, Kenji Nukui, Mutsumi Katou, Yoshitaka Watanabe, Yoichi Fujisawa +3 more 2013-10-29
7517792 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof Toshio Takayama 2009-04-14
7141881 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof Toshio Takayama 2006-11-28