Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof

Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof

US Patent 7517792 · Granted Apr 14, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electric flow control valve and actuator2020
Integrated valve2019
Refrigeration cycle device2019
Integration valve and heat pump cycle2017
Booster2017
Integration valve2015
Compound semiconductor device and method of manufacturing same2015
Indication device2015
Decompression device2014
Motor and vehicle2013
Method of manufacturing compound semiconductor device with gate electrode formin2013
Electrically driven brake booster2011