Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6273317 | Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism | Kenji Arai, Ataru Ichikawa, Atsushi Furumoto, Misao Tanaka, Mitsuhiro Sugiura | 2001-08-14 |