Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11696411 | Sleeve soldering device and method of producing electronic device | Hayato Kiuchi, Kazuyuki Hamamoto, Teruhiko Iwase, Masayuki Fujihira | 2023-07-04 |
| 11618107 | Device for manufacturing electric component and method for manufacturing electric component | Sadayuki Tsuda, Yoshinori Suzuki | 2023-04-04 |
| 11090751 | Reflow device and method for manufacturing substrate using the reflow device | Masayasu Yamamoto, Masato Kamino, Hisahiro Ikeda, Hiroki Kamiya | 2021-08-17 |
| 9124155 | Drive apparatus including motor | Masashi Yamasaki, Hideki Kabune | 2015-09-01 |
| 9088195 | Drive apparatus | Masashi Yamasaki, Hideki Kabune | 2015-07-21 |
| 9025336 | Linked semiconductor module unit and electronic circuit-integrated motor device using same | Hideki Minato, Hideki Kabune | 2015-05-05 |
| 9000633 | Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules | Masashi Yamasaki, Hideki Kabune | 2015-04-07 |
| 8957557 | Drive apparatus | Masashi Yamasaki, Hideki Kabune | 2015-02-17 |
| 8710705 | Drive apparatus | Masashi Yamasaki, Hideki Kabune | 2014-04-29 |
| 8630095 | Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same | Hideki Minato, Hideki Kabune | 2014-01-14 |
| 8338998 | Electronic circuit-integrated motor apparatus | Masashi Yamasaki, Hideki Kabune | 2012-12-25 |
| 8310121 | Electronic circuit-integrated motor drive and semiconductor module | Toshihiro Fujita, Hiroyasu Kidokoro, Hideki Kabune, Hideki Minato | 2012-11-13 |
| 8304942 | Drive apparatus adapted to promote heat dissipation from electronic circuit integrated therein | Masashi Yamasaki, Hideki Kabune | 2012-11-06 |
| 8299664 | Drive apparatus and semiconductor module | Ayako Iwai, Masashi Yamasaki, Hideki Kabune, Yoshimasa Kinpara | 2012-10-30 |
| 8247937 | Semiconductor module and electronic circuit-integrated motor device using same | Hideki Minato, Hideki Kabune, Ayako Iwai | 2012-08-21 |
| 6412682 | Wave soldering method and system used for the method | Ataru Ichikawa, Tatsuya Kubo, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka | 2002-07-02 |
| 6273317 | Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism | Kenji Arai, Ataru Ichikawa, Tatuya Kubo, Misao Tanaka, Mitsuhiro Sugiura | 2001-08-14 |
| 6273319 | Wave soldering method and system used for the method | Ataru Ichikawa, Tatsuya Kubo, Kenji Arai, Mitsuhiro Sugiura, Misao Tanaka | 2001-08-14 |