Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10814418 | Soldering apparatus and method for manufacturing electronic unit | Shinichiro Shiraishi, Chisato Ozawa | 2020-10-27 |
| 6412682 | Wave soldering method and system used for the method | Ataru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Misao Tanaka | 2002-07-02 |
| 6273317 | Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism | Kenji Arai, Ataru Ichikawa, Atsushi Furumoto, Tatuya Kubo, Misao Tanaka | 2001-08-14 |
| 6273319 | Wave soldering method and system used for the method | Ataru Ichikawa, Tatsuya Kubo, Atsushi Furumoto, Kenji Arai, Misao Tanaka | 2001-08-14 |
| 6257480 | Jet soldering method and apparatus | Atushi Furumoto, Ataru Ichikawa, Tatsuya Kubo, Misao Tanaka, Kenji Arai | 2001-07-10 |