| 8754512 |
Atomic level bonding for electronics packaging |
Ralph S. Taylor |
2014-06-17 |
| 6750152 |
Method and apparatus for electrically testing and characterizing formation of microelectric features |
John C. Christenson, John E. Freeman, Troy Chase, Robert Lawrence Healton |
2004-06-15 |
| 6555856 |
Semiconductor device with means for verifying a hermetic seal therefor |
— |
2003-04-29 |
| 6428713 |
MEMS sensor structure and microfabrication process therefor |
John C. Christenson, John E. Freeman, Troy Chase, Robert Lawrence Healton, David B. Rich |
2002-08-06 |
| 6074891 |
Process for verifying a hermetic seal and semiconductor device therefor |
— |
2000-06-13 |
| 5936164 |
All-silicon capacitive pressure sensor |
Douglas Ray Sparks, William J. Baney, Dan W. Chilcott, James Siekkinen |
1999-08-10 |
| 5721162 |
All-silicon monolithic motion sensor with integrated conditioning circuit |
Peter J. Schubert, Dan W. Chilcott, Mark B. Kearney |
1998-02-24 |
| 5706565 |
Method for making an all-silicon capacitive pressure sensor |
Douglas Ray Sparks, William J. Baney, Dan W. Chilcott, James Siekkinen |
1998-01-13 |
| 5415726 |
Method of making a bridge-supported accelerometer structure |
James Logsdon |
1995-05-16 |
| 5413955 |
Method of bonding silicon wafers at temperatures below 500 degrees centigrade for sensor applications |
Han-Sheng Lee, Dan W. Chilcott |
1995-05-09 |
| 5369057 |
Method of making and sealing a semiconductor device having an air path therethrough |
Han-Sheng Lee, James Logsdon, Dan W. Chilcott |
1994-11-29 |
| 5284057 |
Microaccelerometer having low stress bonds and means for preventing excessive Z-axis deflection |
David W. De Roo |
1994-02-08 |
| 5221400 |
Method of making a microaccelerometer having low stress bonds and means for preventing excessive z-axis deflection |
David W. DeRoo |
1993-06-22 |
| 5068203 |
Method for forming thin silicon membrane or beam |
James Logsdon, David W. De Roo, Gerold W. Neudeck |
1991-11-26 |
