Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11560640 | Filling plating system and filling plating method | Naoyuki Omura, Kanako Matsuda | 2023-01-24 |
| 9374913 | Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same | Yoshikazu Saijo, Hisamitsu Yamamoto, Masayuki Utsumi, Takuya Komeda | 2016-06-21 |
| 9359676 | Surface treating apparatus | Teruyuki Hotta, Hisamitsu Yamamoto, Takahiro Ishizaki, Masayuki Utsumi, Syunsaku Hoshi +2 more | 2016-06-07 |