Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421325 | Method for producing a printed wiring board | Yoshikazu Saijo, Nobuhiko Naka | 2022-08-23 |
| 10927463 | Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board | Yoshikazu Saijo, Nobuhiko Naka | 2021-02-23 |
| 10773280 | Ultrasonic treatment apparatus | Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Yutaka NISHINAKA, Yoshinori Nakanishi | 2020-09-15 |
| 10450666 | Copper plating solution and copper plating method | YUKO YOSHIOKA, Tomoharu NAKAYAMA | 2019-10-22 |
| 10435778 | Surface treating apparatus | Masayuki Utsumi, Syunsaku Hoshi, Junji Mizumoto | 2019-10-08 |
| 10138558 | Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same | Yoshikazu Saijo, Tetsuji Ishida, Takuya Komeda, Masayuki Utsumi | 2018-11-27 |
| 9374913 | Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same | Yoshikazu Saijo, Masayuki Utsumi, Takuya Okamachi, Takuya Komeda | 2016-06-21 |
| 9359676 | Surface treating apparatus | Teruyuki Hotta, Takahiro Ishizaki, Masayuki Utsumi, Takuya Okamachi, Syunsaku Hoshi +2 more | 2016-06-07 |
| 9120113 | Surface treating apparatus | Teruyuki Hotta, Masayuki Utsumi, Takahiro Ishizaki | 2015-09-01 |
| 9045836 | Electrolytic regeneration device | Yoshikazu Saijo, Takahiro Ishizaki | 2015-06-02 |
| 8992756 | Direct plating method and solution for palladium conductor layer formation | — | 2015-03-31 |
| 8877020 | Electrolytic regeneration unit and electrolytic regeneration apparatus using same | Masayuki Utsumi, Yoshikazu Saijo, Tomoji Okuda, Hiroki Omura | 2014-11-04 |
| 8828131 | Catalyst application solution, electroless plating method using same, and direct plating method | Tetsuji Ishida | 2014-09-09 |
| 8276270 | Method for manufacturing printed circuit board | Teruyuki Hotta, Shushi Morimoto, Takahiro Ishizaki | 2012-10-02 |