Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11560640 | Filling plating system and filling plating method | Takuya Okamachi, Kanako Matsuda | 2023-01-24 |
| 11248305 | Copper electrolytic plating bath and copper electrolytic plating film | Yuki Itakura, Kazunari Kato, Raihei IKUMOTO | 2022-02-15 |
| 9730337 | Plating method | Toshihisa Isono, Shinji Tachibana, Kanako Matsuda | 2017-08-08 |
| 9028668 | Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath | Toshihisa Isono, Koji Shimizu, Shinji Tachibana | 2015-05-12 |
| 8801912 | Continuous copper electroplating method | Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi | 2014-08-12 |
| 8679317 | Copper electroplating bath | Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase | 2014-03-25 |
| 7988842 | Continuous copper electroplating method | Shinji Tachibana, Koji Shimizu, Tomohiro Kawase, Toshihisa Isono, Kazuyoshi NISHIMOTO | 2011-08-02 |
| 7892411 | Electrolytic copper plating process | Shinji Tachibana, Tomohiro Kawase, Toshihisa Isono, Koji Shimizu | 2011-02-22 |
| 7220347 | Electrolytic copper plating bath and plating process therewith | Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase | 2007-05-22 |