ST

Shinji Tachibana

CC C.Uyemura & Co.: 9 patents #8 of 180Top 5%
MC Mitsui Chemicals: 4 patents #512 of 2,279Top 25%
TI Takeda Chemical Industries: 2 patents #497 of 1,420Top 35%
HH Hitachi High-Technologies: 1 patents #1,282 of 1,917Top 70%
JC Japan Composite Co.: 1 patents #4 of 13Top 35%
MC Mitsubishi Gas Chemical Company: 1 patents #1,048 of 1,727Top 65%
Overall (All Time): #271,817 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
11421135 Curable composition, coating material, solar cell coating material, solar cell back sheet coating material, adhesive, solar cell adhesive, solar cell back sheet adhesive, producing method of sheet, and curing agent Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Hideaki Otsuka 2022-08-23
11389818 Surface treatment apparatus and surface treatment method Tomoji Okuda, Daisuke Matsuyama, Masayuki Utsumi 2022-07-19
11072678 Blocked isocyanate, coating composition, adhesive composition, and article Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu MASUI, Hirokazu Mizuma +1 more 2021-07-27
10385157 Blocked isocyanate, coating composition, adhesive composition, and article Kazuyuki Fukuda, Jun Kamada, Takashi Uchida, Masakazu MASUI, Hirokazu Mizuma +1 more 2019-08-20
10163223 Automatic analyser 2018-12-25
9822212 Polyisocyanate composition, solar cell member covering material, solar cell member with cover layer, microcapsule, and binder for ink Toshihiko Nakagawa, Takashi Kanno, Satoshi Yamasaki, Yoshihiro Matsumoto, Takashi Uchida +2 more 2017-11-21
9730337 Plating method Toshihisa Isono, Naoyuki Omura, Kanako Matsuda 2017-08-08
9028668 Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath Toshihisa Isono, Naoyuki Omura, Koji Shimizu 2015-05-12
8801912 Continuous copper electroplating method Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Tomohiro Kawase, Shunsaku Hoshi 2014-08-12
8679317 Copper electroplating bath Toshihisa Isono, Tomohiro Kawase, Naoyuki Omura 2014-03-25
7988842 Continuous copper electroplating method Koji Shimizu, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Kazuyoshi NISHIMOTO 2011-08-02
7892411 Electrolytic copper plating process Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Koji Shimizu 2011-02-22
7604755 Electroconductive resin composition and separator for fuel cell Hiroya Okumura, Keizo Kimura, Takeshi Kusagaya 2009-10-20
7507587 Automatic analysis and control system for electroless composite plating solution Tadashi Chiba, Koji Monden, Kazuki Yoshikawa 2009-03-24
7220347 Electrolytic copper plating bath and plating process therewith Toshihisa Isono, Tomohiro Kawase, Naoyuki Omura 2007-05-22
6352775 Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same Ichiro Sasaki, Tatsuo Fujii 2002-03-05
5298559 Multi-layered polymers Tatsuo Fujii, Junji Oshima, Goro Shimaoka, Kazuhiko Ishii, Makoto Mizutani 1994-03-29