Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131985 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard | 2024-10-29 |
| 12046481 | Systems and methods for reducing via formation impact on electronic device formation | Sean Matthew Garner, Robert George Manley | 2024-07-23 |
| 12013619 | Methods for forming thin film transistors on a glass substrate and liquid crystal displays formed therefrom | Ming-Huang Huang, Robert Bumju Lee, Bin Zhu | 2024-06-18 |
| 11777067 | Bezel-free display tile with edge-wrapped conductors and methods of manufacture | Jiangwei Feng, Sean Matthew Garner, Jen-Chieh Lin, Robert George Manley, Timothy James Orsley +4 more | 2023-10-03 |
| 11756847 | Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer | Kaveh Adib, Philip Simon Brown, Mandakini Kanungo, Prantik Mazumder | 2023-09-12 |
| 11654657 | Through glass via fabrication using a protective material | Robert George Manley | 2023-05-23 |
| 11456225 | Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer | Kaveh Adib, Philip Simon Brown, Mandakini Kanungo, Prantik Mazumder | 2022-09-27 |
| 11329228 | Polar elastomer microstructures and methods for fabricating same | Robert George Manley, Karan Mehrotra, Barry James Paddock, Nikolay Zhelev Zhelev, Bin Zhu | 2022-05-10 |
| 11282994 | Bezel-free display tile with edge-wrapped conductors and methods of manufacture | Jiangwei Feng, Sean Matthew Garner, Jen-Chieh Lin, Robert George Manley, Timothy James Orsley +4 more | 2022-03-22 |
| 11257728 | Fluidic assembly substrates and methods for making such | Robert Alan Bellman | 2022-02-22 |
| 11201109 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard | 2021-12-14 |
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Mandakini Kanungo, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore +3 more | 2021-10-19 |
| 10957628 | Bottom up electroplating with release layer | Robert Alan Bellman | 2021-03-23 |
| 10424606 | Systems and methods for reducing substrate surface disruption during via formation | Sean Matthew Garner, Daniel Wayne Levesque, JR., Robert George Manley, Garrett Andrew Piech, Heather Nicole Vanselous | 2019-09-24 |
| 8491712 | Dehydration systems and methods for removing water from a gas | Ganesh Prasadh Kidambi, Sachin Suhas Naphad | 2013-07-23 |