Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12207405 | Beveled overburden for vias and method of making the same | Dhananjay Joshi, Scott Christopher Pollard | 2025-01-21 |
| 12131985 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Ah-Young Park, Scott Christopher Pollard, Rajesh Vaddi | 2024-10-29 |
| 11760682 | Glass or glass ceramic articles with copper-metallized through holes and processes for making the same | — | 2023-09-19 |
| 11201109 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Ah-Young Park, Scott Christopher Pollard, Rajesh Vaddi | 2021-12-14 |
| 11171094 | Hermetic fully-filled metallized through-hole vias | Prantik Mazumder, Ah-Young Park, Scott Christopher Pollard, Navaneetha Krishnan Subbaiyan | 2021-11-09 |
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Mandakini Kanungo, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore +3 more | 2021-10-19 |