Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12222308 | Methods for making electrodes and providing electrical connections in sensors | Shrisudersan Jayaraman | 2025-02-11 |
| 11846597 | Methods for making electrodes and providing electrical connections in sensors | Shrisudersan Jayaraman | 2023-12-19 |
| 11680908 | Assembly having nanoporous surface layer with hydrophobic layer | Jeffrey Stapleton King | 2023-06-20 |
| 11171094 | Hermetic fully-filled metallized through-hole vias | Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard | 2021-11-09 |
| 11158519 | Method of forming capped metallized vias | William Richard Trutna | 2021-10-26 |