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Inorganic wafer having through-holes attached to semiconductor wafer |
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Methods of etching glass substrates and glass substrates |
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Use of a binary salt flux of NaCl and MgCl2 for the purification of aluminium or aluminium alloys, and method thereof |
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Method and system for determining material properties using ultrasonic attenuation |
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Apparatus and method for evaluating the physical properties of a sample using ultrasonics |
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Ultrasonic spectroscopy apparatus for determining thickness and other properties of multilayer structures |
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High resolution ultrasonic interferometry for quantitative mondestructive characterization of interfacial adhesion in multilayer composites |
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