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Inorganic wafer having through-holes attached to semiconductor wafer |
Daniel Wayne Levesque, JR., Garrett Andrew Piech |
2020-08-25 |
| 10510576 |
Carrier-bonding methods and articles for semiconductor and interposer processing |
Darwin Gene Enicks, John Tyler Keech, Windsor Pipes Thomas, III |
2019-12-17 |
| 10435796 |
Work piece including a sacrificial cover layer for laser drilling substrates |
Jeffrey John Domey, John Tyler Keech, Xinghua Li, Garrett Andrew Piech, Paul John Shustack +1 more |
2019-10-08 |
| 10366904 |
Articles having holes with morphology attributes and methods for fabricating the same |
Andres Covarrubias Jaramillo, Yuhui Jin, Frank Andrew Kramer, IV, Ekaterina Aleksandrovna Kuksenkova, Daniel Wayne Levesque, JR. +2 more |
2019-07-30 |
| 10134657 |
Inorganic wafer having through-holes attached to semiconductor wafer |
Daniel Wayne Levesque, JR., Garrett Andrew Piech |
2018-11-20 |
| 9758876 |
Sacrificial cover layers for laser drilling substrates and methods thereof |
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2017-09-12 |
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Edge finishing apparatus |
Charles Michael Darcangelo, Steven Edward DeMartino, Daniel Duane Strong, David Alan Tammaro, Butchi Reddy Vaddi |
2017-07-18 |
| 9102030 |
Edge finishing apparatus |
Charles Michael Darcangelo, Steven Edward DeMartino, Daniel Duane Strong, David Alan Tammaro, Butchi Reddy Vaddi |
2015-08-11 |
| 8986072 |
Methods of finishing an edge of a glass sheet |
Charles Michael Darcangelo, Daniel Duane Strong, David Alan Tammaro |
2015-03-24 |
| 8974268 |
Method of preparing an edge-strengthened article |
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2015-03-10 |
| 8419508 |
Methods of fabricating a honeycomb extrusion die from a die body |
Raymond Charles Cady, Mihir Mahendra Shah, Kevin Lee Wasson |
2013-04-16 |