Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6023962 | Reservoir-slit rheometer for the viscosity measurement of fast-reacting polymers | Sejin Han | 2000-02-15 |
| 6000924 | Pressurized underfill encapsulation of integrated circuits | Sejin Han | 1999-12-14 |
| 5817545 | Pressurized underfill encapsulation of integrated circuits | Sejin Han | 1998-10-06 |
| 5572434 | Method for simulating mold filling of semi-solid material | Shau-Poh Wang | 1996-11-05 |
| 5501266 | Method and apparatus for injection molding of semi-solid metals | Hsuan-Yi PENG, Nan Wang, Shau-Poh Wang | 1996-03-26 |
| 4861167 | Line-heat-source thermal conductivity measuring system | Hubert Lobo | 1989-08-29 |