Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5572434 | Method for simulating mold filling of semi-solid material | Kuo K. Wang | 1996-11-05 |
| 5501266 | Method and apparatus for injection molding of semi-solid metals | Kuo K. Wang, Hsuan-Yi PENG, Nan Wang | 1996-03-26 |