Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12240971 | Thermoplastic resin composition, method of preparing the same, and molded article including the same | Seongkyun KIM, Seo Hwa KIM, Byoung Il Kang, Yeongmin KIM | 2025-03-04 |
| 11702536 | Thermoplastic resin composition, method of preparing thermoplastic resin composition, and metal-plated molded article manufactured using thermoplastic resin composition | Ju Hyeong Lee, Byoung Il Kang, Seo Hwa KIM, Seongkyun KIM | 2023-07-18 |
| 6023962 | Reservoir-slit rheometer for the viscosity measurement of fast-reacting polymers | Kuo K. Wang | 2000-02-15 |
| 6000924 | Pressurized underfill encapsulation of integrated circuits | Kuo K. Wang | 1999-12-14 |
| 5817545 | Pressurized underfill encapsulation of integrated circuits | Kuo K. Wang | 1998-10-06 |