Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8622278 | Socket cover with heat flow for surface mount solder reflow | Victor Alvarez, Steven R. Vandervoort, Shijiang He | 2014-01-07 | $13,955,000 |
| 5339536 | Apparatus and method for solder paste printing process for printed circuit boards | — | 1994-08-23 | $25,122,000 |