Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8622278 | Socket cover with heat flow for surface mount solder reflow | Victor Alvarez, Steven R. Vandervoort, Shijiang He | 2014-01-07 |
| 5339536 | Apparatus and method for solder paste printing process for printed circuit boards | — | 1994-08-23 |