Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Socket cover with heat flow for surface mount solder reflow

Socket cover with heat flow for surface mount solder reflow

US Patent 8622278 · Granted Jan 7, 2014

Estimated economic value: $13,955,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hermetically sealed external cavity laser system and method2004
Apparatus and method for solder paste printing process for printed circuit board1994