Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6239480 | Modified lead frame for improved parallelism of a die to package | John MacPherson | 2001-05-29 |
| 6235556 | Method of improving parallelism of a die to package using a modified lead frame | John MacPherson | 2001-05-22 |