Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508676 | Semiconductor package structure having hollow chamber and bottom substrate and package process thereof | Cheng-Hung Shih, Shu-Chen Lin, Fu-Yen Ho, Yen-Ting Chen | 2016-11-29 |
| 8877629 | Semiconductor manufacturing process and structure thereof | Cheng-Hung Shih, Kai Wang | 2014-11-04 |
| 8581239 | Package structure and semiconductor structure thereof | Cheng-Hung Shih, Shu-Chen Lin, Jun-Yu Yeh | 2013-11-12 |
| 8530344 | Method for manufacturing fine-pitch bumps and structure thereof | Cheng-Hung Shih, Shu-Chen Lin, Cheng-Fan Lin, Hua-An Dai | 2013-09-10 |
| 8501614 | Method for manufacturing fine-pitch bumps and structure thereof | Cheng-Hung Shih, Shu-Chen Lin, Cheng-Fan Lin, Hua-An Dai | 2013-08-06 |
| 8497579 | Semiconductor packaging method and structure thereof | Cheng-Hung Shih, Shu-Chen Lin, Cheng-Fan Lin, Bo-Shiun Jiang | 2013-07-30 |