Jun-Yu Yeh

CTChipbond Technology: 1 patents #42 of 88Top 50%

Overall (All Time): #3,183,999 of 4,157,543Top 80%

1 Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
8581239	Package structure and semiconductor structure thereof	Cheng-Hung Shih, Shu-Chen Lin, Yung-Wei Hsieh	2013-11-12