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Hua-An Dai

CT Chipbond Technology: 2 patents #24 of 88Top 30%
Overall (All Time): #2,076,007 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8530344 Method for manufacturing fine-pitch bumps and structure thereof Cheng-Hung Shih, Yung-Wei Hsieh, Shu-Chen Lin, Cheng-Fan Lin 2013-09-10
8501614 Method for manufacturing fine-pitch bumps and structure thereof Cheng-Hung Shih, Yung-Wei Hsieh, Shu-Chen Lin, Cheng-Fan Lin 2013-08-06