Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640478 | Semiconductor device having low dielectric insulating film and manufacturing method of the same | Aiko Mizusawa, Osamu Okada, Takeshi Wakabayashi | 2017-05-02 |
| 9070638 | Semiconductor device having low dielectric insulating film and manufacturing method of the same | Aiko Mizusawa, Osamu Okada, Takeshi Wakabayashi | 2015-06-30 |
| 8871627 | Semiconductor device having low dielectric insulating film and manufacturing method of the same | Aiko Mizusawa, Osamu Okada, Takeshi Wakabayashi | 2014-10-28 |
| 8749065 | Semiconductor device comprising electromigration prevention film and manufacturing method thereof | Ichiro Kouno, Takeshi Wakabayashi | 2014-06-10 |
| 8587124 | Semiconductor device having low dielectric insulating film and manufacturing method of the same | Aiko Mizusawa, Osamu Okada, Takeshi Wakabayashi | 2013-11-19 |
| 8507309 | Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same | Takeshi Wakabayashi | 2013-08-13 |
| 8293574 | Semiconductor device having a plurality of semiconductor constructs | — | 2012-10-23 |
| 8278734 | Semiconductor device and manufacturing method thereof | — | 2012-10-02 |
| RE43380 | Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Hiroyasu Jobetto, Takeshi Wakabayashi | 2012-05-15 |
| 8067274 | Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method | Takeshi Wakabayashi | 2011-11-29 |
| 7867826 | Semiconductor device packaged into chip size and manufacturing method thereof | Takeshi Wakabayashi | 2011-01-11 |
| RE41511 | Semiconductor device having a thin-film circuit element provided above an integrated circuit | Yutaka Aoki, Takeshi Wakabayashi, Katsumi Watanabe | 2010-08-17 |
| 7737543 | Semiconductor device and method of manufacturing the same | Hiroyasu Jobetto | 2010-06-15 |
| 7719116 | Semiconductor device having reduced number of external pad portions | Takeshi Wakabayashi | 2010-05-18 |
| 7692282 | Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Hiroyasu Jobetto, Takeshi Wakabayashi | 2010-04-06 |
| 7618886 | Semiconductor device and method of manufacturing the same | Hiroyasu Jobetto | 2009-11-17 |
| 7592672 | Grounding structure of semiconductor device including a conductive paste | Takeshi Wakabayashi, Osamu Okada | 2009-09-22 |
| 7563640 | Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Hiroyasu Jobetto, Takeshi Wakabayashi | 2009-07-21 |
| 7550833 | Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof | — | 2009-06-23 |
| 7550843 | Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member | — | 2009-06-23 |
| 7547967 | Semiconductor device and method of manufacturing the same | Hiroyasu Jobetto | 2009-06-16 |
| 7528480 | Circuit board, semiconductor device, and manufacturing method of circuit board | — | 2009-05-05 |
| 7514335 | Semiconductor device and method of manufacturing the same | Takeshi Wakabayashi | 2009-04-07 |
| 7459340 | Semiconductor device and manufacturing method thereof | Takeshi Wakabayashi | 2008-12-02 |
| 7445964 | Semiconductor device and method of manufacturing the same | Takeshi Wakabayashi, Toshihiro Kido, Hiroyasu Jobetto, Yutaka Yoshino, Nobuyuki Kageyama +2 more | 2008-11-04 |