Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8268674 | Semiconductor device and method for manufacturing the same | — | 2012-09-18 |
| 8237277 | Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same | — | 2012-08-07 |
| RE43380 | Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Takeshi Wakabayashi, Ichiro Mihara | 2012-05-15 |
| 8063490 | Semiconductor device including semiconductor constituent | — | 2011-11-22 |
| 8004089 | Semiconductor device having wiring line and manufacturing method thereof | — | 2011-08-23 |
| 7972903 | Semiconductor device having wiring line and manufacturing method thereof | — | 2011-07-05 |
| 7910405 | Semiconductor device having adhesion increasing film to prevent peeling | Osamu Okada | 2011-03-22 |
| 7867828 | Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein | — | 2011-01-11 |
| 7843071 | Semiconductor device including wiring and manufacturing method thereof | — | 2010-11-30 |
| 7790515 | Semiconductor device with no base member and method of manufacturing the same | — | 2010-09-07 |
| 7737543 | Semiconductor device and method of manufacturing the same | Ichiro Mihara | 2010-06-15 |
| RE41369 | Semiconductor device and method of manufacturing the same | — | 2010-06-08 |
| 7727862 | Semiconductor device including semiconductor constituent and manufacturing method thereof | — | 2010-06-01 |
| 7709942 | Semiconductor package, including connected upper and lower interconnections | — | 2010-05-04 |
| 7692282 | Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Takeshi Wakabayashi, Ichiro Mihara | 2010-04-06 |
| 7618886 | Semiconductor device and method of manufacturing the same | Ichiro Mihara | 2009-11-17 |
| 7615411 | Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof | — | 2009-11-10 |
| 7608480 | Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion | — | 2009-10-27 |
| 7582512 | Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device | — | 2009-09-01 |
| 7563640 | Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof | Shinji Wakisaka, Takeshi Wakabayashi, Ichiro Mihara | 2009-07-21 |
| 7547967 | Semiconductor device and method of manufacturing the same | Ichiro Mihara | 2009-06-16 |
| 7489032 | Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same | — | 2009-02-10 |
| 7445964 | Semiconductor device and method of manufacturing the same | Ichiro Mihara, Takeshi Wakabayashi, Toshihiro Kido, Yutaka Yoshino, Nobuyuki Kageyama +2 more | 2008-11-04 |
| 7427812 | Semiconductor device with increased number of external connection electrodes | Shinji Wakisaka | 2008-09-23 |
| 7378645 | Optical sensor module with semiconductor device for drive | Ichiro Mihara | 2008-05-27 |