Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691688 | Thin plastic leadless package with exposed metal die paddle | Mow Lum Yee, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip | 2017-06-27 |
| 9190385 | Thin plastic leadless package with exposed metal die paddle | Mow Lum Yee, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip | 2015-11-17 |
| 7846774 | Multiple row exposed leads for MLP high density packages | Mow Lum Yee, Chee Heng Wong, Shang Yan Choong, Kok Siang Goh, Voon Joon Liew +2 more | 2010-12-07 |
| 7351611 | Method of making the mould for encapsulating a leadframe package | Richard Mow Lum Yee, Chee Heng Wong, Chee Ching Yip, Sasidharan Suresh Dass, Kok Siang Goh | 2008-04-01 |