Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7351611 | Method of making the mould for encapsulating a leadframe package | Chee Heng Wong, Chee Ching Yip, Sasidharan Suresh Dass, Kam Chuan Lau, Kok Siang Goh | 2008-04-01 |