Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691688 | Thin plastic leadless package with exposed metal die paddle | Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip | 2017-06-27 |
| 9190385 | Thin plastic leadless package with exposed metal die paddle | Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip | 2015-11-17 |
| 7846774 | Multiple row exposed leads for MLP high density packages | Chee Heng Wong, Shang Yan Choong, Kam Chuan Lau, Kok Siang Goh, Voon Joon Liew +2 more | 2010-12-07 |