Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6758949 | Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities | Praburam Gopalraja, Jianming Fu | 2004-07-06 |
| 6743342 | Sputtering target with a partially enclosed vault | — | 2004-06-01 |
| 6730196 | Auxiliary electromagnets in a magnetron sputter reactor | Praburam Gopalraja, Jianming Fu | 2004-05-04 |
| 6709553 | Multiple-step sputter deposition | Praburam Gopalraja, Jianming Fu | 2004-03-23 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +1 more | 2002-09-17 |
| 6436251 | Vault-shaped target and magnetron having both distributed and localized magnets | Praburam Gopalraja, Jianming Fu | 2002-08-20 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Praburam Gopalraja, Jianming Fu, Zheng Xu | 2002-07-02 |
| 6358376 | Biased shield in a magnetron sputter reactor | Jianming Fu, Praburam Gopalraja | 2002-03-19 |
| 6352629 | Coaxial electromagnet in a magnetron sputtering reactor | — | 2002-03-05 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2001-08-14 |