Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8455577 | Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method | Toshikazu Baba, Yoshihiro Kawamura | 2013-06-04 |
| 8304341 | Dicing die-bonding film | Takeshi Matsumura, Sadahito Misumi | 2012-11-06 |
| 8287706 | Laminated gas sensor element, gas sensor equipped with laminated gas sensor element, and method for manufacturing laminated gas sensor element | Tatsuhiko MURAOKA | 2012-10-16 |
| 8277625 | Gas sensing device and gas sensor | Shigeki Mori, Nobuo Furuta, Yuuya Nakayama | 2012-10-02 |
| 8178420 | Dicing/die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura | 2012-05-15 |
| 8080143 | Gas sensor element, method for manufacturing the same, and gas sensor | Shigeki Mori, Akinori Kojima, Shigeo Kondo | 2011-12-20 |
| 8026045 | Method of manufacturing wiring circuit board | Hirofumi Fujii | 2011-09-27 |
| 7910631 | Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition | Hirofumi Fujii, Katsutoshi Hirashima, Kyouyuu Jo | 2011-03-22 |
| 7863182 | Dicing die-bonding film | Takeshi Matsumura, Sadahito Misumi | 2011-01-04 |
| 7811434 | Gas sensor | Shigeki Mori, Shigeo Kondo, Nobuo Furuta | 2010-10-12 |
| 7780811 | Dicing die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura, Sadahito Misumi | 2010-08-24 |
| 7771576 | Gas sensor and method for manufacturing gas sensor | Shigeki Mori, Shigeo Kondo | 2010-08-10 |
| 7646103 | Dicing/die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura | 2010-01-12 |
| 7615115 | Liquid-phase growth apparatus and method | Katsumi Nakagawa, Takehito Yoshino, Shoji Nishida | 2009-11-10 |
| 7553197 | Connector with securely lockable front mask | — | 2009-06-30 |
| 7508081 | Dicing die-bonding film | Takeshi Matsumura, Sadahito Misumi | 2009-03-24 |
| 7449226 | Dicing die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura, Sadahito Misumi | 2008-11-11 |
| 7407547 | Liquid-phase growth apparatus and method | Katsumi Nakagawa, Takehito Yoshino, Shoji Nishida | 2008-08-05 |
| 7377824 | Connector and connector assembly | Tomoyoshi Fukaya, Kazuaki Takeda, Tsutomu Tanaka | 2008-05-27 |
| 7282190 | Silicon layer production method and solar cell production method | Shoji Nishida, Katsumi Nakagawa | 2007-10-16 |
| 7175706 | Process of producing multicrystalline silicon substrate and solar cell | Shunichi Ishihara, Katsumi Nakagawa, Hiroshi Sato, Takehito Yoshino, Shoji Nishida +3 more | 2007-02-13 |
| 7118625 | Liquid phase growth method for silicon crystal, manufacturing method for solar cell and liquid phase growth apparatus for silicon crystal | Shoji Nishida, Takehito Yoshino, Masaaki Iwane | 2006-10-10 |
| 7060339 | Dicing/die-bonding film, method of fixing chipped work and semiconductor device | Takeshi Matsumura | 2006-06-13 |
| 7048797 | Liquid-phase growth process and liquid-phase growth apparatus | Takehiko Yoshino, Shoji Nishida | 2006-05-23 |
| 7022181 | Liquid phase growth process, liquid phase growth system and substrate member production method | Katsumi Nakagawa, Tetsuro Saito, Tatsumi Shoji, Takehito Yoshino, Shoji Nishida +2 more | 2006-04-04 |