Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12489089 | Chip package structure with conductive shielding film | Chen-Hwa Yu, An-Jhih Su, Po-Hao Tsai | 2025-12-02 | |
| 9274724 | Distributed virtual tape library | Hao Wang, Teng Zhang, Michael Chen | 2016-03-01 | $9,628,000 |
| 9251609 | Timelined spider diagrams | Hao Wang, Shujun Wang | 2016-02-02 | $18,451,000 |
| 5971606 | Module and apparatus for measuring temperature properties of an SRAM IC | Fu Wang | 1999-10-26 |