Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103048 | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates | Tony D. Flaim | 2018-10-16 |
| 9827757 | Methods of transferring device wafers or layers between carrier substrates and other surfaces | Tony D. Flaim, Susan E. Bailey | 2017-11-28 |
| 9472436 | Multiple bonding layers for thin-wafer handling | Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim | 2016-10-18 |
| 9263314 | Multiple bonding layers for thin-wafer handling | Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim | 2016-02-16 |
| 9224631 | Multiple bonding layers for thin-wafer handling | Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim | 2015-12-29 |
| 9111981 | Method for reversibly mounting a device wafer to a carrier substrate | Tony D. Flaim | 2015-08-18 |
| 9099512 | Article including a device wafer reversibly mountable to a carrier substrate | Tony D. Flaim | 2015-08-04 |
| 8852391 | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate | Robert D. Brown | 2014-10-07 |
| 7790231 | Automated process and apparatus for planarization of topographical surfaces | James E. Lamb, III | 2010-09-07 |
| 7775785 | Contact planarization apparatus | Robert D. Brown | 2010-08-17 |
| 6598765 | Disposable syringe dispenser system | Russell T. Pagel, Jeffrey Lawrence Kohne | 2003-07-29 |