Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355966 | Substrate warpage control using external frame stiffener | Adam Gallegos | 2016-05-31 |
| 7659622 | Trace design to minimize electromigration damage to solder bumps | Dennis H. Eaton | 2010-02-09 |
| 7579753 | Transducers with annular contacts | R. Shane Fazzio, Atul Goel | 2009-08-25 |
| 7538477 | Multi-layer transducers with annular contacts | R. Shane Fazzio, Atul Goel | 2009-05-26 |
| 7253528 | Trace design to minimize electromigration damage to solder bumps | Wayne P. Richling, William S. Graupp | 2007-08-07 |
| 7208843 | Routing design to minimize electromigration damage to solder bumps | Wayne P. Richling, William S. Graupp | 2007-04-24 |
| 6661666 | Device for enhancing the local cooling of electronic packages subject to laminar air flow | — | 2003-12-09 |
| 6320754 | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package | Pedro F. Engel | 2001-11-20 |