Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355966 | Substrate warpage control using external frame stiffener | Walter Dauksher | 2016-05-31 |
| 9070674 | Through-silicon coaxial via structure and method | Thomas E. Cynkar | 2015-06-30 |
| 9041208 | Laminate interconnect having a coaxial via structure | Mark A. Hinton, Nurwati Devnani, John Connor | 2015-05-26 |