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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
RY

Renyi Yang — 7 Patents

ATAT&T: 3 patents #5,559 of 18,772Top 30%
FUFuzhou University: 1 patents #38 of 171Top 25%
THTriquint Technology Holding: 1 patents #47 of 141Top 35%
Allentown, PA: #215 of 1,150 inventorsTop 20%
Pennsylvania: #11,887 of 74,527 inventorsTop 20%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Renyi Yang has been granted 7 US patents while listed as an inventor at AT&T. The first was granted in 1999 and the most recent in February 2024. Renyi Yang ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Renyi Yang in Allentown, PA, US.

Patents per Year

Patents granted per year, 1999 to 2024Bar chart with a peak of 2 patents in 1999.peak 21999: 2 patents19992002: 1 patents20022003: 2 patents20032022: 1 patents20222024: 1 patents2024

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11909278 Production apparatus of motor laminated core and method for producing the same Yuan Xiang, Xiudong Huang, Hongbo Wang, Bo Yang, Haodong Shi +1 more 2024-02-20
11493167 Plane-distributed load sharing pressure device and use method thereof Yingjie Cai, Ligang Yao, Zhiming Xu, Chaoqian Dong 2022-11-08
6632028 Apparatus and method for aligning an optical fiber with an optical device Thomas B. Reynolds, Robert A. Craven, Aaron Hawkins 2003-10-14
6580543 Multimode fiber communication system with enhanced bandwidth Zhencan Frank Fan, Hong-Tai Man, Arlen R. Martin, Steven Luther Moyer, Mary Nadeau +4 more 2003-06-17 $12,073,000
6371665 Plastic packaged optoelectronic device Joseph P. Keska, Steven Luther Moyer, Mary Nadeau, John W. Osenbach 2002-04-16 $13,204,000
5971257 Method for use in bonding a chip to a substrate 1999-10-26 $85,525,000
5927589 Method and fixture for use in bonding a chip to a substrate 1999-07-27 $52,855,000