Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9012308 | Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto | Darwin Gene Enicks, Damian Carver | 2015-04-21 | $3,774,000 |
| 8530934 | Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto | Darwin Gene Enicks, Damian Carver | 2013-09-10 | $5,806,000 |
| 6855618 | Radiation hardened semiconductor device | Richard L. Woodruff, Scott M. Tyson, David B. Kerwin | 2005-02-15 | $7,912,000 |
| 6511893 | Radiation hardened semiconductor device | Richard L. Woodruff, Scott M. Tyson, David B. Kerwin | 2003-01-28 | $9,972,000 |
| 6063690 | Method for making recessed field oxide for radiation hardened microelectronics | Richard L. Woodruff, David B. Kerwin | 2000-05-16 | |
| 5037781 | Multi-layered field oxide structure | Richard L. Woodruff, Craig Hafer | 1991-08-06 | $4,578,000 |